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Nowadays, Wi-Fi devices are ubiquitous in our lives. Casually open the home wireless routing management interface, there may be no less than 10 Wi-Fi devices online at the same time. The increase in the number of devices leads to network congestion, performance degradation, increased delay and other problems. These problems became more serious in the era of Wi-Fi 5 (802.11 ac). Therefore, when designing Wi-Fi 6 (802.11 ax), experts made improvements and innovations specifically for the problem of network congestion. So, what new technologies does Wi-Fi 6 use to improve wireless channel capacity? When the user equipment receives the AP signal, it will compare whether the color it receives is consistent with the current associated AP color. When the color is the same, the user will think that the signal is the signal in the cell. If the color of the received signal is different from that of the associated AP, the user determines that the signal belongs to the interference signal. As shown in the following figure, due to the use of different color codes, the channel 1 of the green cell is no longer interfered by the adjacent cell channel 1 (blue and red).

With the increasing degree of automation of cars and electric vehicles, the number of semiconductors required will increase sharply. Most semiconductors are traditional analog and power semiconductors. These traditional analog and power semiconductors are produced by 8-inch factories. Because it is difficult to ensure 8-inch manufacturing equipment, it is difficult to add new 8-inch semiconductor factories. In short, self-driving cars certainly need state-of-the-art semiconductors to run advanced artificial intelligence (AI), but the need for a large number of traditional analog and power semiconductors has become the Achilles’ heel of automobile production, and it is not easy to solve this problem. Although the automobile industry has ushered in an once-in-a-century period of great change in CASE (Connected, Autonomous/Automated, Shared, Electric), it is also an era suffering from the shortage of semiconductors.

In the onboard system shown in the figure above, the green rectangle represents the printed circuit board (PCB), and the small rectangles of various colors above represent various functional modules in the system, such as memory. The functions of these modules are implemented by independent silicon chips, and they are connected by metal traces on the PCB to finally form a complete system. The System-on-Chip refers to the realization of the functions of the entire system on a single silicon chip. The schematic diagram is as follows: As shown in the figure above, a system-on-a-chip (SoC) implements various functional modules such as storage, processing, logic, and interfaces in one chip, rather than requiring several different physical chips to be implemented like a system-on-board. Compared with system-on-board, SoC solutions are lower cost, enable faster and more secure data transfer between different system units, have higher overall system speed, lower power consumption, smaller physical size, and better reliability.

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